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PDS1040CTL
Document number: DS30485 Rev. 13 - 2
2 of 5
www.diodes.com
February 2014
? Diodes Incorporated
PDS1040CTL
Maximum Ratings
(@TA
= +25°C, unless otherwise specified.)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40 V
RMS Reverse Voltage
VR(RMS)
28 V
Average Rectified Output Current (See also Figure 5) per element
total device
IO
5
10
A
Non-Repetitive Peak Forward Surge Current, per element
8.3ms Single half sine-wave Superimposed on Rated Load
IFSM
110 A
Thermal Characteristics
Characteristic Symbol Typ Max Unit
Thermal Resistance Junction to Soldering Point
RθJS
?
2.0
°C/W
Thermal Resistance Junction to Ambient Air (Note 5)
RθJA
95
?
°C/W
Thermal Resistance Junction to Ambient Air (Note 6)
RθJA
75
?
°C/W
Thermal Resistance Junction to Ambient Air (Note 7)
RθJA
50
?
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 8)
V(BR)R
40
?
?
V
IR
= 500μA
Forward Voltage Per Element
VF
?
0.465 0.50
0.39 0.43
V 0.55 0.60
IF
= 5A, T
S
= +25
°C
?
0.41 0.45
IF
= 5A, T
S
= +100
°C
?
IF
= 5A, T
S
= +125
°C
?
IF
= 10A, T
S
= +25
°C
?
0.53 0.57
IF
= 10A, T
S
= +100
°C
?
0.52 0.56
IF
= 10A, T
S
= +125
°C
Reverse Leakage Current (Note 8) Per Element
IR
?
20 200 μA VR
= 40V, T
S = +25°C
?
3 25 mA
VR
= 40V, T
S = +100°C
?
15 150 μA
VR
= 35V, T
S = +25°C
?
2.5 10 mA
VR
= 35V, T
S = +100°C
?
6 80 μA
VR
= 17.5V, T
S = +25°C
?
1 5 mA
VR
= 17.5V, T
S = +100°C
Notes: 5. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com.
6. Polyimide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com.
7. Polyimide PCB, 2 oz. Copper. Cathode pad dimensions
9.4mm x 7.2mm. Anode pad
dimensions 2.7mm x 1.6mm.
8. Short duration pulse test used to minimize self-heating effect.
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